SUPER SHIELD NICKEL PRINT

SUPER SHIELD NICKEL PRINT

Loctite Henkel 1993881 GC 10 Solder Paste, No-Clean, SAC305 T4, Temperature Stable, 500 Gram Jar. Expired Date Code GC10SAC305T3885V52U

Loctite Henkel 1993881 GC 10 Solder Paste, No-Clean, SAC305 T4, Temperature Stable, 500 Gram Jar. Expired Date Code GC10SAC305T3885V52U

.062 AIM SN96.5 AG3.5 1 LB ROLL SILVER ROSIN CORE SOLDER, Lead Free

Features: - High Activity Level - Fully Activated Flux - Improved Wetting Properties - Good Thermal Transfer - Glycol-Free *Meets QQS-571-E Specification and Applicable IPC-J-STD-004 and -006 Requirements Description: RA is a fully activated, general-purpose wire solder for use in applications where mildly activated fluxes are too weak. RA cored wire is strong enough for excellent tarnish and oxide removal, and will produce bright shiny solder joints. RA wire will leave slight to moderate post process residues that may be left on noncritical applications, but should be removed from any critical applications. RA cored wire meets Mil-Spec cleanliness requirements post-cleaning. IPC flux classification for this material is ROM1. Availability: - RA is standard 2.0% flux core for lead-free alloys. - RA is available in Sn/Pb, Sn/Ag/Cu, SN100C® alloys. - Standard spool sizes: ½ lb. for .010 and .015 diameters; 1 lb. for .020, .032, .040, .050, and .062 diameters. - Packaging of ½ lb. and 1 lb. spools is standard in 12 lb. and 24 lb. cases. - Other flux percentages, alloys, diameters and spool sizes may be available upon special request. Application: - Solder iron tip temperature should be between 340°C-400°C (650°F-750°F) for Sn63, Sn62 and Sn60 alloys, 370°C425°C (700°F-800°F) for Sn/Ag and Sn/Ag/Cu alloys and 340°C-370°C (650°F-700°F) for Sn43/Pb43/Bi14. - Hold the solder iron at a 45° to 60° angle to the work surface. - The solder iron should contact both the component lead and PCB pad surface. - Solder and flux should flow onto both the lead and pad or lead and barrel to promote optimum flux activity to the joint being worked. - If additional flux is needed, the use of AIM’s RA301 flux is recommended. Operators should use an applicator capable of dispensing precise amounts of flux to eliminate over-saturation and excessive spread. Cleaning: If post-process cleaning is desired, is easiest if performed within a two to three hour period. Adequate cleaning may be accomplished using a saponifier. AIMTERGE-520A is recommended. A temperature of 35°C-65°C (100ºF-150ºF) is sufficient for removing residues. An in-line or other pressurized spray cleaning system is suggested, but is not required. Lead Free Silver Solder Rosin Core
Item# 14763
$32.50
Availability: In stock