Medium Cure Thermal Conductive Adhesive Epoxy

The 8329TCM Medium Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines moderate curing rate and high thermal conductivity. It has a convenient 1-to-1 ratio, a workable 45 minutes pot life, and a moderate curing rate. It may achieve a minimal service cure in seven hours at room temperature. The cured adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks. The 8329TCM is used for thermal management situations requiring superior bonding strengths and good thermal transfers. For example, it is used to as a die-attach for electrical and electronics, increasing their long term reliability. It is great for heat sink bonding. It is also used as a high-powered LED adhesive that maximizes the lifetime of LEDs by dissipating their heat. - See more at: http://www.mgchemicals.com/products/adhesives/thermally-conductive/medium-cure-thermal-conductive-adhesive/#sthash.Pm80OAzO.dpuf Excellent 1.36 W/(m•K) thermal conductivity, thermal epoxy Easy 1:1 mix ratio Adheres to most electronic substrates Stores and ships at slightly below room temperature — no freezing or dry ice required Very long shelf life of at least two years — even when stored at room temperature Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons - See more at: http://www.mgchemicals.com/products/adhesives/thermally-conductive/medium-cure-thermal-conductive-adhesive/#sthash.Pm80OAzO.dpuf